CEKD Berhad Signs IPO Underwriting Agreement with M A Securities
- Written by ACN Newswire - Press Releases
KUALA LUMPUR, Aug 2, 2021 - (ACN Newswire) - CEKD Berhad ("CEKD" or the "Company"), a die-cutting solutions provider as well as manufacturer of die-cutting moulds and trader of related consumables, tools and accessories, has on even date signed an underwriting agreement with M&A Securities Sdn Bhd ("M&A Securities"). This underwriting
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