Headquartered in Singapore and listed in the Hong Kong Stock Exchange, ASMPT is the world's largest back-end semiconductor equipment supplier and SMT Solutions provider. ASMPT will rename Amicra to ASM AMICRA Microtechnologies GmbH as it integrates Amicra into ASMPT's Back-end Equipment segment.
"We are excited about this strategic investment," said Mr. Lee Wai Kwong, CEO of ASM Pacific Technology. "Amicra's sub-micron high accuracy die bonder is complementary to the Group's existing product portfolio. Amicra has a leading position in the photonics market which the Group believes is of high growth potential. I am confident that this combination will further strengthen our future growth opportunities and help to deliver even higher value-add to our customers."
"Following our increasing penetration of markets for high precision die attach, especially in the rapidly growing area of Silicon Photonics manufacturing, it makes a lot of sense to merge with a strong strategic partner to better support our growing international customers base. With their scale and established international supply chain, sales channel and customers support capability, the merger with ASMPT will allow us to take next steps in the further development of our business. I am happy for Amicra and our customers and I am excited about the opportunity to work with the ASMPT" says Mr Rudolf Kaiser, managing director of Amicra.
About ASM Pacific Technology As a global technology and market leader, ASMPT (HKEX stock code: 0522), develops and provides leading edge solutions and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial, LED and alternative energy.
Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Hong Kong 35 Index and the Hang Seng Global Composite Index. To learn more about ASMPT, please visit our website at www.asmpacific.com.
About AMICRA MicroTechnologies
AMICRA MicroTechnologies is a worldwide leading supplier of ultra-precise die bonding equipment supporting placement accuracies down to 0.3im @ 3o. Founded in 2001 and headquartered in Regensburg, Germany, we provide leading-edge products and engineering services for back-end manufacturing and packaging processes to customers in multiple segments of the electronics industry. We are a market leader in the silicon photonics and fiber optics markets. Our equipment enables Die Attach and Flip Chip bonding, With particular expertise in the photonics market and servicing the rapidly growing hyperscale datacenter market.
Amicra also offers High Speed Dispensing System, as well as offering Custom Solutions based on our technological platform. Amicra maintains a global sales and support network with representative offices throughout Europe, North America, Asia Pacific and as well, China.
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